If you are a design engineer, it pays to know how and why EMI testing is conducted, as well as the typical causes of failure. This course provides ways to prevent common EMI/EMC problems regarding power supplies, cables, connectors, slots, discontinuity of ground planes, and more. The focus is on EMI and RFI issues regarding PCBs as well as relevant EMI regulations in the U.S. and the European Union. Highlights include PCB radiation basics, radiation and bypass on PCBs, PCB radiation suppression techniques, grounding designs/filtering, crosstalk/termination, power and ground planes, antenna loops, spread spectrum clocking, and differential-mode and common-mode radiation.
This course covers the following topics: how the EMI/EMC tests are conducted and how to avoid many configuration layout problems; design techniques to minimize radiation/susceptibility for both digital and analog PCBs; grounding and shielding techniques; and how to overcome radiation problems with connectors, cables, and hardware slots.
This is one of five courses that comprise a week of instruction in high-speed digital design/EMI. Participants may take it on a stand-alone basis or in any combination with the other four courses:
- Transmission Lines
- Crosstalk, Layer Stacking, Separating Analog/Digital Planes, and Terminations
- Bypassing, Power Delivery, Vias, Connectors, and Buses
- Differential Signaling and Clock Distribution Control
Lecture notes are distributed on the day of the course. These notes are for participants only and are not for sale. Fee includes materials for each course(s) taken.
Coordinator and Lecturer
Robert Hanson, MSEE, President, Americom Seminars, Inc., Bremerton, Washington. Mr. Hanson has over 40 years of experience in the design manufacturing and test areas. His initial education was in industrial engineering (IE) and business administration. After receiving his BSEE/MSEE, he became highly involved in all aspects of electronic testing. As a digital design engineer at The Boeing Company, Rockwell, Honeywell, and Loral, Mr. Hanson designed and provided prototype operational analysis on many high-speed designs, including PCBs for AWACS, B1-B, 747-400, missiles, and ground support test equipment. He has played a very active role in automating the line, implemented robotics, participated in producibility studies, and automatic material handling. He has held positions responsible for overseeing and working in the CAE/CAD/CAT, JIT, simulation, and automatic assembly environments. He also has performed studies and headed research projects in the computer-integrated manufacturing environment. Mr. Hanson has extensive experience in the testing disciplines (both factory and field, commercial and military) and has been the testability overseer for Boeing Commercial Airline products.
EMI, Source, Path, and Receptor
- Why all three must be present to have an EMI problem
- EMI regulations/standards for USA, Europe (EU), and Asia
- Course notes provide a detailed description of all the test requirements, equipment to conduct the tests, and the governing bodies/committees that mandate the tests
- Power Disturbances
- Impedance dimensions
Conducting an EMI Test
- Precompliance, compliance testing, and post-audit testing
- What is uncertainty and how does it affect the test plan?
How Tests are Conducted
For all of the following tests, the hardware instrumentation, layout, pass/fail criteria, and tips/techniques to pass the test are covered. The test site also is defined, i.e., OATS, screen room, anechoic chamber, and TEM cell. The step-by-step sequence of how each test is conducted is detailed.
- Conducted emissions
- Radiated emissions
- RF immunity
- Conducted RF immunity
- Electrical fast transient
For more information contact the Short Course Program Office:
firstname.lastname@example.org | (310) 825-3344 | fax (310) 206-2815